About Business

IT Division

Automation Division


Technology Status

Hardware

Ability to implement precision stage (X-Y-Z)

Compact design capability

X-Ray Camera Design Capability

Know-how of Vacuum System Design

Software

PC Algorithm Design Capability

Vision Sys. Programming design ability

Compact PLC Programming

High frequency control system design ability

Man Power

Instrument design field, average of more than 10 years experience

Program field, average over 10 years experience

Instrument assembly and A / S field, average of more than 10 years experience


Major customers

Major Domestic Customers

Major Overseas Customers


Major products

Definition

It is a process for producing MLB (Multi-Layer Board), which requires equipment for stacking boards

Kinds

High frequency bonding machine, heater bonding machine, LAY-UP SYSTEM, CARRIER PLATE return system, X-RAY DRILLING MACHINE etc.

Used process

Pre-and post-lamination process according to the manufacture of Multi Layer Board

Definition

Equipment to process raw materials (CCL, PP, copper foil, etc.) and subsidiary materials (AL FOIL, etc.) in PCB manufacturing according to the task size

Kinds

CCL (RCC) cutter, PP (Prepreg) cutter, Copper (AL) Foil cutter, PP Drilling Machine etc.

Used process

Initial cutting process, CNC process, lamination process etc.

Definition

Automation equipment used in the entire process of PCB. It is divided into equipment (LOADER) to load the board and equipment (UNLOADER) to automatically receive the board.

Kinds

VERTICAL TYPE, HORIZONTAL TYPE, BOX(TRAY) TYPE, BASKET TYPE, MAGAZINE TYPE, LOADERS & UNLOADERS

Used process

Used as input / receiver in all processes of PCB manufacturing

Definition

Other related equipment in PCB manufacturing

Kinds

CLEAN MACHINE, WICKET cooler, STOCKER(BUFFER), STACK MASTER, TAPPING M/C etc.

Used process

PCB manufacturing process for automation line


Products (lamination process)

X-Ray Drilling M/C (HR-E2M)

Equipment overview

Equipment to process a reference hole for forming an outer layer circuit on an MLB (multilayer circuit board) (Applicable to both rigid and FPCB boards)

Applied process

Hot Press process -> X-Ray Drilling M/C -> Router process

Main Specifications

1. Number of holes: 7 Holes or more

2. Drill Bit : Up to Ø6mm

3. Drilling range: X axis - 290 ~ 700mm, Y axis - 0 ~ 610mm

4. Spindle: Electric spindle

5. Degree of Drill: Up to ± 10 ~ 20㎛ (Applied Rotary & Linear Servo System)

Features

1. Holding the board in a stable manner to minimize machining variations as much as possible

2. Providing the user-friendly way of working

3. Providing simple board processing registration procedure and storage

4. Applying stable X-Ray Tube and Camera System Structure

5. Applying a Hole cap and burr generation plan

Optional

1. Dust collector

2. Application of AL-coil Roll to Roll System for thin boards

3. In Line Auto Loading System(X-Ray Aligner)

4. Auto Unloading with sorting

5. 4-axis Drilling System

High Frequency Bonding M / C (HBM-I08)

Equipment overview

Equipment that partially combines the inner layer board and the insulation (Prepreg) to form the outer layer board (Applicable to both rigid and FPCB boards)

Applied process

Oxidation process -> Bonding Machine -> Lay Up process(Hot Press)

Main Specifications

1. Number of bonding: 4

2. Bonding Thickness: Up to 8mm

3. Align. method: CCD Camera

4. Number of tables: Left / Right Shuttle (2)

5. Bonding method: High frequency bonding

6. Degree of bonding: ±20㎛

7. Bonding time: Change according to thickness and materials

Features

1. Elimination of scratch causes through the adoption of gripping method

2. Improvement of working speed by two Shuttle Table methods

3. Guarantee of precision suitable for multi-layer or fine pattern manufacturing

4. Improved productivity through the adoption of reliable automatic unloading method

Optional

1. Automatic loading system

2. Automatic width adjustment method

3. Bonding points change etc.

BONDING M/C(HBM-02)

Equipment overview

Equipment that partially combines the inner layer board and the insulation (Prepreg) to form the outer layer board (Applicable to both rigid and FPCB boards)

Applied process

Oxidation process -> Bonding Machine -> Lay Up process (Hot Press)

Main Specifications

1. Number of bonding: More than 12

2. Bonding Thickness: Up to 4 mm

3. Number of Guide Pins: 4

4. Number of tables: Shuttle method (2)

5. Temperature control: Individual control method

6. Bonding time: Change according to thickness and materials (15 seconds or more)

Features

1. Improvement of working speed by two Shuttle Table methods

2. Application of bonding heater of spring type to minimize defect rate

3. Improvement of bonding degree by application of flexible pin

4. Stable operation with Torque motor

Optional

1. Heater shape freedom (square, circle, round, etc.) and pin specification changeable

2. Automatic width adjustment method

3. Touch screen method

4. Cooling Units applicable / Teflon Sheet mounting method

LAY UP SYSTEM(LP-1000)

Equipment overview

Equipment to automatically stack SUS plate and copper foil on the carrier plate and to stack multilayer circuit board

Applied process

Bonding Machine -> Lay Up System -> Hot Press 공정

Main Specifications

1. Transfer materials: SUS Plate, Copper Foil / Carrier Plate etc.

2. Alignment method: Center alignment

3. Load quantity: According to Hot Press specification

4. Transfer method: Servo System & Gripper

5. Carrier transfer: Hydraulic cylinder & motor type

6. SUS Plate : Injector or In line (preprocessor)

Features

1. Possible to handle thin copper foil

2. Adoption of fast and accurate transfer method

3. Precise location marking with Laser Guide

Optional

1. Two-layer lamination possible

2. Automatic width adjustment method (SUS plate, Copper Foil Pad, etc.)

3. System Carrier Con'y Logistics System

4. Automatic Lay Up System available


Product (Loader / Unloader)

Other products